Axiro Semiconductor Pvt. Ltd. is a leading fabless semiconductor 公司 based in Bengaluru, India, specializing in 高-performance chip design for global 5G/6G, defence, satellite communication, and 工业的 物联网 markets. 后退ed by the Murugappa Group through CG Power, Axiro leverages advanced design capabilities and strategic global manufacturing partnerships to deliver millions of ICs. With a strong focus on innovation, IP ownership in India, and sustainable growth, Axiro is at the forefront of India’s semiconductor mission.

职位描述

We are seeking an experienced 汽车 Cockpit Solutions Engineer to design, integrate, and 支持 advanced cockpit systems for 下一个-generation connected and autonomous vehicles. In this role, you willwork at the intersection of hardware, software, and system design to deliver complete cockpit solutions including digital clusters, infotainment, HUD, and human–machine interfaces (HMI). You will play a key role inenabling immersive, safe, and 高‑performance in‑vehicle user experiences. This position requires deep expertise in 汽车 SoCs, graphics and display technologies, operating system internals, BSPdevelopment, and system-level integration, along with strong customer-facing and problem-solving skills.

职责 

• Cockpit System 建筑学: Define and 支持 end-to-end 汽车 cockpit solutions including infotainment, digital instrument clusters, HUD, and multi-显示系统s.​

• HW/SW Integration: Work closely with silicon, BSP, middleware, and 应用 software 团队s to integrate hardware and software components into complete cockpit platforms.​

• OS & BSP Development: 支持 Linux, QNX, and Android 汽车 platforms, including kernel, middleware, device drivers, bootloaders, power management, and memory initialization.​

• SoC Bring-Up: Lead or 支持 early silicon and board bring-up activities, including BSP customization and platform stabilization.​

• Peripheral Integration: Integrate and debug peripherals such as display controllers, GPUs, touch controllers, audio DSPs, connectivity modules, USB, CAN, Ethernet, and PCIe.​

• Graphics & Multimedia Optimization: Debug and optimize graphics pipelines, video play后退, camera inputs, audio synchronization, and overall system performance.​

• Networking & Communication: 支持 汽车 networking technologies including 汽车 Ethernet, SOME/IP, CAN, and related communication stacks.​

• Performance, Power & Thermal Optimization: Diagnose and resolve complex system issues related to performance bottlenecks, stability, power consumption, and thermal constraints.​

• Reference Designs & Demos: Develop and 支持 reference designs, evaluation kits, and demos to enable customer design-in and 销售 engagement.​

• Customer Engagement: Act as a technical interface to 汽车 OEMs and Tier‑1 customers during system integration, debug, and qualification phases.​

• Cross-功能al Collaboration: Work closely with 建筑学, validation, product, and marketing 团队s to ensure solution readiness and product success.​

• 文档 & Training: Create technical 文档 and deliver training for customers and internal 团队s.​

要求

• Education: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field; Master’s degree preferred.​

• Experience: 8+ years of experience in 汽车 systems, embedded platforms, or semiconductor 应用s engineering.​

• Operating Systems: Hands-on experience with Linux, QNX, or Android 汽车 OS internals, including kernel, middleware, and device driver development.​

• BSP & Bring-Up: Strong understanding of SoC bring-up and BSP development, including bootloaders, power management, and memory initialization.​

• Peripherals & Interfaces: Pr烤箱 experience integrating displays, GPUs, touch, audio, connectivity, USB, CAN, Ethernet, and PCIe for infotainment systems.​

• Debug Expertise: Demonstrated ability to debug complex issues related to graphics performance, audio synchronization, system stability, and power/thermal behavior.​

• 汽车 Networking: Experience with 汽车 Ethernet, SOME/IP, and in-vehicle communication stacks.​

• 汽车 Standards: Familiarity with 汽车 development processes and standards (ISO 26262, ASPICE, AEC‑Q).​

• Customer-Facing Skills: Strong ability to 支持 OEM and Tier‑1 customer engagements.​

• Communication: Excellent verbal and written communication skills.​

• Problem-Solving: Strong analytical and system-level debugging skills.