Axiro Semiconductor is a fabless semiconductor design 公司 headquartered in Bengaluru, driving innovation in RF, wireless 基础设施, satellite communication (Satcom), and 高-speed connectivity solutions. 后退ed by CG Power & 工业的 Solutions Ltd. part of the 120-year-old Murugappa Group. Axiro represents India’s leap into the global semiconductor arena. With millions of chips already powering global networks, a world-class 团队 across India, the US, and Europe, and cutting-edge expertise spanning RF, mmWave, GaN, and 下一个-generation communication technologies, Axiro is engineering the future of how the world connects, computes, and communicates. For more 细节 – www.axiro.com

职位描述

The IC 包裹 Process Intern will contribute to the development and optimization of advanced semiconductor packaging technologies. This role offers an opportunity to work closely with 包裹 Design, Manufacturing, Supply Chain, Quality, and OSAT partners to 支持 new product introduction (NPI), process standardization, and continuous improvement initiatives. The intern will 获得 hands-on experience in assembly process development for cutting-edge semiconductor 包裹s.

职责 

• Collaborate with Packaging, Design, Manufacturing, Supply Chain, and Quality 团队s to 支持 包裹 development activities.
• Assist in assembly process development and optimization for QFN, FCCSP, FCBGA, and module-based 包裹s.
• 支持 OSAT partners in new product introduction (NPI), process qualification, and manufacturing readiness activities.
• Analyze process performance data to identify opportunities for yield improvement and defect reduction.
• Participate in failure analysis, root cause investigations, and corrective 行动 implementation for quality and reliability issues.
• 支持 process characterization, validation, and standardization efforts across 包裹 assembly operations.
• Prepare technical reports, presentations, and engineering 文档 to communicate project progress and results.
• Contribute to continuous improvement initiatives focused on manufacturing efficiency, process robustness, and product quality.

要求

• Currently pursuing or recently completed a B.E./B.Tech/M.E./M.Tech/MSC in Electronics, Electrical Engineering, Materials Science, Semiconductor Technology, Applied Physics, or a related discipline.
• Basic understanding of semiconductor devices, fabrication processes, and semiconductor packaging technologies.
• Strong analytical, problem-solving, and data interpretation skills.
• Proficiency in Microsoft Excel and PowerPoint; familiarity with statistical analysis tools

 

Learning Opportunities

• 获得 hands-on experience in advanced semiconductor 包裹 development and assembly processes.
• Work closely with industry experts, OSAT partners, and cross-功能al engineering 团队s.
• Develop practical knowledge of QFN, FCCSP, FCBGA, and module 包裹 technologies.
• Learn semiconductor packaging process flows, qualification methodologies, yield analysis, and quality improvement techniques.
• Exposure to new product introduction (NPI), process optimization, and manufacturing operations in a 高-tech semiconductor environment.

Desired Attributes

• Strong analytical thinking and structured problem-solving approach.
• Effective communication and presentation skills.
• Ability to collaborate in a cross-功能al and fast-paced engineering environment.
• Eagerness to learn and adapt to new technologies and challenges.
• Passion for semiconductor devices, packaging technologies, and manufacturing excellence.

 

Additional 信息

Preferred CGPA: 7.0/10 or above
Internship Duration: 6 Months 

Career Opportunity: 高-performing interns may be considered for a full-time employment opportunity upon successful completion of the internship, based on individual performance, business 要求, and role availability.