Axiro Semiconductor Pvt. Ltd. is a leading fabless semiconductor 公司 based in Bengaluru, India, specializing in 高-performance chip design for global 5G/6G, defence, satellite communication, and 工业的 物联网 markets. 后退ed by the Murugappa Group through CG Power, Axiro leverages advanced design capabilities and strategic global manufacturing partnerships to deliver millions of ICs. With a strong focus on innovation, IP ownership in India, and sustainable growth, Axiro is at the forefront of India’s semiconductor mission.

职位描述

We are seeking an experienced 应用s Engineering / BSP (Board 支持 包裹) Manager to lead our customer-facing technical 团队 and drive successful integration of our semiconductor solutions into customer platforms. In this role, you will manage a 团队 of 应用 engineers focused on hardware bring-up, BSP development, and system-level 支持. You will play a critical role in bridging product development and customer success by delivering optimized solutions and ensuring ecosystem readiness.​

This position requires strong technical expertise in embedded systems, BSP development, semiconductor 建筑学s, and excellent leadership and communication skills.​

职责 

• Manage and mentor a 团队 of 应用s engineers and BSP developers, fostering technical excellence and professional growth.​
• Serve as the primary technical interface for customers, ensuring successful product integration and 地址ing technical challenges.​
• Oversee development and optimization of Board 支持 包裹s, including bootloaders, device drivers, and OS integration.​
• Work closely with SoC design, software, validation, and product engineering 团队s to resolve issues and deliver 高-quality solutions.​
• Define 应用 engineering and BSP strategies to 支持 new product introductions and market expansion.​
• Ensure creation of technical 文档, reference designs, and training materials for customers and internal 团队s.​
• Gather customer feed后退 and provide insights to product development 团队s to influence future product roadmaps.​
• Lead efforts to diagnose and resolve complex hardware/software integration issues.​

要求

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field; Master’s degree preferred.​
• 10+ years in semiconductor 应用s engineering or embedded systems development, with at least 3 years in a leadership role.​
• Strong understanding of BSP development, embedded operating systems (Linux, RTOS), device drivers, and SoC 建筑学s.​
• Proficiency in C/C++, scripting languages, and familiarity with hardware bring-up and debugging tools.​
• Pr烤箱 ability to manage technical engagements with global customers.​
• Ability to lead and develop 高-performing 团队s.​
• Excellent verbal and written communication skills for diverse audiences.​
• Strong analytical skills and ability to resolve complex technical issues.​