Axiro Semiconductor Pvt. Ltd. is a leading fabless semiconductor company based in Bengaluru, India, specializing in high-performance chip design for global 5G/6G, defence, satellite communication, and industrial IoT markets. Backed by the Murugappa Group through CG Power, Axiro leverages advanced design capabilities and strategic global manufacturing partnerships to deliver millions of ICs. With a strong focus on innovation, IP ownership in India, and sustainable growth, Axiro is at the forefront of India’s semiconductor mission.

Job Description

We are seeking an experienced Applications Engineering / BSP (Board Support Package) Manager to lead our customer-facing technical team and drive successful integration of our semiconductor solutions into customer platforms. In this role, you will manage a team of application engineers focused on hardware bring-up, BSP development, and system-level support. You will play a critical role in bridging product development and customer success by delivering optimized solutions and ensuring ecosystem readiness.​

This position requires strong technical expertise in embedded systems, BSP development, semiconductor architectures, and excellent leadership and communication skills.​

Responsibilities 

• Manage and mentor a team of applications engineers and BSP developers, fostering technical excellence and professional growth.​
• Serve as the primary technical interface for customers, ensuring successful product integration and addressing technical challenges.​
• Oversee development and optimization of Board Support Packages, including bootloaders, device drivers, and OS integration.​
• Work closely with SoC design, software, validation, and product engineering teams to resolve issues and deliver high-quality solutions.​
• Define application engineering and BSP strategies to support new product introductions and market expansion.​
• Ensure creation of technical documentation, reference designs, and training materials for customers and internal teams.​
• Gather customer feedback and provide insights to product development teams to influence future product roadmaps.​
• Lead efforts to diagnose and resolve complex hardware/software integration issues.​

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field; Master’s degree preferred.​
• 10+ years in semiconductor applications engineering or embedded systems development, with at least 3 years in a leadership role.​
• Strong understanding of BSP development, embedded operating systems (Linux, RTOS), device drivers, and SoC architectures.​
• Proficiency in C/C++, scripting languages, and familiarity with hardware bring-up and debugging tools.​
• Proven ability to manage technical engagements with global customers.​
• Ability to lead and develop high-performing teams.​
• Excellent verbal and written communication skills for diverse audiences.​
• Strong analytical skills and ability to resolve complex technical issues.​