Product Selector
Part Number (3)
AX100
P101A21
Description
Automotive applications processor for next-gen instrument cluster and infotainment
Primary application CPU
6× Cortex-A55 @ 2.0 GHz
Secondary application CPU
-
GPU
IMG PowerVR 9XM GPU
AI/ML Acceleration
High-efficiency AI accelerator; supports TensorFlow/Caffe
Video Encode/Decode
H.264 encode/decode; H.265, VP8, VP9 decode
Display Interfaces
2× 4-lane MIPI-DSI; 4× LVDS
Camera Interfaces
2× 4-lane MIPI-CSI with 4 virtual channels; 1× 8-bit Parallel CSI
External DRAM Interface
32-bit DRAM interface @ 4267 MT/s; LPDDR4/LPDDR4x; DDR4; optional inline ECC
High-Speed Interfaces
2× USB 3.0; 2× PCIe 3.0 RC/EP dual-role
Storage Interfaces
2× eMMC 5.1; 2× SD 3.0/SDIO; 1× QuadSPI/OctalSPI
Secure processor / HSM
Cortex-R5 in DCLS mode; 32 KB I-cache + 32 KB D-cache; 128 KB TCM
Junction Temperature
-40 to 125°C Tj
Automotive qualification / ESD
AEC-Q100 Grade 2, -40 to 105°C; HBM ESD Level 2; CDM ESD Level C1
Package (mm)
21 × 21 FCBGA
AX110
P111A21
Description
Automotive applications processor for next-gen Entry eCockpit
Primary application CPU
6× Cortex-A55 @ 2.0 GHz
Secondary application CPU
1× Cortex-A55 @ 1.4 GHz
GPU
IMG PowerVR 9XM GPU
AI/ML Acceleration
High-efficiency AI accelerator; supports TensorFlow/Caffe
Video Encode/Decode
H.264 encode/decode; H.265, VP8, VP9 decode
Display Interfaces
2× 4-lane MIPI-DSI; 4× LVDS
Camera Interfaces
2× 4-lane MIPI-CSI with 4 virtual channels; 1× 8-bit Parallel CSI
External DRAM Interface
32-bit DRAM interface @ 4267 MT/s; LPDDR4/LPDDR4x; DDR4; optional inline ECC
High-Speed Interfaces
2× USB 3.0; 2× PCIe 3.0 RC/EP dual-role
Storage Interfaces
2× eMMC 5.1; 2× SD 3.0/SDIO; 1× QuadSPI/OctalSPI
Secure processor / HSM
Cortex-R5 in DCLS mode; 32 KB I-cache + 32 KB D-cache; 128 KB TCM
Junction Temperature
-40 to 125°C Tj
Automotive qualification / ESD
AEC-Q100 Grade 2, -40 to 105°C; HBM ESD Level 2; CDM ESD Level C1
Package (mm)
21 × 21 FCBGA
AX150
P151A21
Description
Automotive applications processor for next-gen eCockpit, virtual cluster, and infotainment
Primary application CPU
8× Cortex-A55 @ 2.3 GHz (w/ inline ECC support)
Secondary application CPU
4× Cortex-A55 @ 2.0 GHz (w/ inline ECC support)
GPU
IMG PowerVR 9XM GPU
AI/ML Acceleration
High-efficiency NPU
Video Encode/Decode
H.264 encode/decode; H.265 encode/decode
Display Interfaces
2× 4-lane MIPI-DSI; 4× LVDS
Camera Interfaces
2× 4-lane MIPI-CSI with 4 virtual channels; 1× 8-bit Parallel CSI
External DRAM Interface
LPDDR4/LPDDR4x; optional inline ECC
High-Speed Interfaces
2× USB 3.0; 2× PCIe 3.0 RC/EP dual-role
Storage Interfaces
2× eMMC 5.1; 2× SD 3.0/SDIO; 1× QuadSPI/OctalSPI
Secure processor / HSM
Cortex-R5 in DCLS mode; 32 KB I-cache + 32 KB D-cache; 128 KB TCM; ECC on cache and TCM
Junction Temperature
-40 to 125°C Tj
Automotive qualification / ESD
AEC-Q100 Grade 2, -40 to 105°C; HBM ESD Level 2; CDM ESD Level C1
Package (mm)
21 × 21 FCBGA
